Copper Via Fill Plating Process
03 Jan 2008
This process, which we are now able to undertake in house, will give a flat pad finish to aid the assembly of BGA devices.
Latest News
Express Circuits Ltd purchase "flat pad" Grinding machine
IPC 6012 class 2 and 3 Approvals gained
Express Circuits Ltd are pleased to announce the gaining of IPC 6012 class 2 and 3 approvals. This approval enhances our capability to produce high quality complex multilayer printed circuit boards.
